Specialist
Former project manager at TankeBlue Semiconductor Co Ltd
Agenda
- Cost dynamics, technological barriers and manufacturing techniques for third-generation semiconductor wafers – silicon and epitaxial
- Key success factors and core competitive advantages in developing third-generation semiconductor materials
- Third-generation semiconductor materials demand across market segments in China, plus substitution for second-generation semiconductor materials
- Materials production line operations, yields, CAPEX trends, production capacity ramp-up time frames and ROI dynamics
- Strengths and weaknesses of major Chinese third-generation semiconductor companies and potential opportunities
Questions
1.
How much do you expect the penetration of third-generation semiconductor materials to increase in China in the future? How high can the penetration of silicon carbide (SiC) chips be in 5G base station and new energy vehicle industries? What will be the main growth drivers for China’s third-generation semiconductor material market?
2.
Suppose the penetration of SiC devices reaches the level you just predicted in the next five years, how much will the costs of those devices decrease? What are some of the factors that may drive down the costs?
3.
What are the potential technologies and solutions to reduce the dislocation density and improve the yield rate?
4.
What are the advantages and disadvantages of the vacuum system with build-in coils and that with external coils?
5.
What are the core equipment in SiC substrate production lines? How come that many manufacturers can’t buy the equipment in the market and have to develop their own equipment? What are the barriers to equipment R&D? Could you analyse the R&D cost and time frames?
6.
How difficult is it for manufacturers to develop their own equipment for mass production or production capacity expansion? How long does the equipment R&D process usually take?
7.
If the penetration rate of SiC chips in the new energy vehicle industry reaches 90% in the future, how is the cost of SiC chips compared with that of traditional silicon chips?
8.
What is the production capacity of a SiC substrate production line? What is the initial capital investment in the production line? What is the production capacity ramp-up time frame?
9.
What is the profitability of domestic SiC substrate manufacturers? How much equipment should they have to realise economies of scale?
10.
Can you evaluate the leading domestic third-generation semiconductor companies in terms of their strengths, weaknesses and core competencies? How do you compare their equipment, technologies and management?
11.
There are a few Chinese manufacturers that only produce SiC epitaxial wafers while all foreign manufacturers seem to provide substrates, epitaxial wafers and related equipment at the same time. Different manufacturers cover different sectors in China. Some only specialise in producing epitaxial wafers. Could you share your views on these manufacturers?
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